Realizing ultra slim size and reliable sensing performance Série BTF
Realization of super-slim size by adopting one-chip photo IC (W13 x H19 x L3.7mm : Through-beam type), (W13 x H24 x L3.7mm : Diffuse reflective type)
No effects of background objects with Background Suppression (B.G.S) function: Stable sensing to minimize the error range made by color or glossy of sensing target
Easy to check sensing spot position by applying visible red LED light source
Protection structure IP67 (IEC standard)
Reverse polarity, Output short-circuit protection circuit
It is to minimize the effect of background objects placed further than sensing distance by adopting two-segment photo diodes so that any malfunctions made by change of background colors or un-necessary movements can be prevented.
Detecting wafers in semiconductor equipment